C. Scott Brown/Android Authority
TL;DR
- Samsung Exynos 2700 processor will have DRAM as well as processor.
- This should improve thermal performance, leading to better sustained performance and cooler temperatures.
- This follows the Exynos 2600’s use of a heat path block to reduce heating.
The Samsung Exynos 2600 processor powers the Galaxy S26 and S26 Plus in some markets. However, the company is undoubtedly working on the Exynos 2700 with a view to using it on the Galaxy S27 series. Now, it looks like we’ve got the first information about the new chipset.
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We can confirm that the Samsung Exynos 2700 will have the processor and DRAM sitting side-by-side on the same substrate. This would be a significant change from previous Exynos chips, which placed DRAM on top of the processor’s substrate.
Then what is the reason for this change? We believe this approach should provide better thermal performance. This is good news, especially in light of leaks that Arm’s next Ultra CPU cores could offer a maximum clock speed of around 5GHz. This next generation CPU core is also expected to be used in the Exynos 2700.
This news comes after Samsung added a so-called Heat Path Block (HPB) to the Exynos 2600. The HPB is effectively a heat sink, and it was previously next to the DRAM but above the chipset (see image above). So we’re speculating that the HPB can now cover both DRAM and the processor due to the Exynos 2700’s new side-by-side approach.
In any case, we’re glad to see Samsung taking these steps to improve thermal performance. If the combination of HPB and the side-by-side approach bears fruit, we could see great sustained performance and low device temperatures. This will be good news for demanding workloads like heavyweight games or APV video capture.
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